Vacuum sintering furnace are the items to be heated in a vacuum environment protective sintering furnace. Vacuum induction sintering furnace is evacuated, then filled the hydrogen protection status, the use of medium frequency induction heating principle, in the crucible within the coil to produce high temperature, thermal radiation conduction to work. Can be used in the production of micro-assembly, the material of the substrate or the like sintered welding.

Typical applications: advanced packaging, power semiconductor, hybrid microelectronics assembly, optoelectronic packaging, hermetic packaging, wafer-level packaging

l  Heating plate size: 300x300mm2;

l  Max.Board height 50mm;

l  Available process gases H2, N2, up to 100%, 95/5 in N2/H2, HCOOH,.

l  Maximum heating rate 100K/min.

l  Maximum cooling rate: 80K/min.

l  mbar vacuum degree. Vacuum pumping speed: 4m3 / h.

l  Process temperature: up to 450 ° C.